Apple commits $30 billion to Broadcom for US chip manufacturing through 2031

Apple has announced a multi-year commitment expected to exceed $30 billion with technology firm Broadcom to develop and supply custom silicon components in the United States. The agreement, confirmed on July 8, 2026, represents Apple's largest single commitment to date under its American Manufacturing Program.

The collaboration deepens the existing operational relationship between the two companies through 2031. According to a regulatory filing submitted by Broadcom earlier in the week, the updated long-term agreements secure the design and production of wireless connectivity technologies for Apple devices. This includes advanced radio frequency components such as FBAR filters.

Reporting indicates the investment will directly fund expanded domestic manufacturing infrastructure. The capital is expected to support operations at Broadcom's US facilities, including reported capacity expansions at its Colorado factory, shifting a critical portion of Apple's component production onshore.

The transaction indicates a strategic priority for Apple to secure custom hardware amidst growing global supply chain complexities. By committing $30 billion over the next five years, the company ensures stable access to the foundational silicon and radio frequency components that govern device connectivity.

Details regarding the precise deployment of funds and manufacturing timelines are still emerging. The confirmed scale of the agreement, however, signals a substantial structural adjustment in Apple's long-term component sourcing and domestic infrastructure strategy.